Improve Efficiency in High-Volume Manufacturing

Designed to tackle tough tasks

The automated IC test handler GCOM-6040 is an unmatched automated testing solution for different ICs (DRAM, LPDDR and NAND). It can handle up to 80 pieces of ICs in parallel testing, while keeping the integrity of both the tests and DUTs. With the automated IC handler and temperature control settings, the GCOM-6040 can support any testing needs while minimizing potential issues.

The GCOM-6040 handler has an intuitive software GUI - making it easier for engineers to focus on what really matters: the DUTs. The interface can also track multiple testing aspects simultaneously, such as the temperature and the machine settings. With the ability to track multiple tests on one screen, engineers can get better results with less effort at times.

Introducing the Automated IC Test Handler GCOM-6040

Work together seamlessly

Drag and Drop Operation

Loading & Unloading Robot

• 6 pickers (variable pitch)
• Rubber pad pickup

Shuttle Buffer

• Place 80 each pockets
• Supports load and unloading

Test Contractor

• One touch clamp (Easy Kit)
• Direct heating

Tray Stacker

• Loader, Empty tray stacker: 30 trays
• Unloading stacker: 4 auto bins
• Manual stacker: 2 manual bins
• Top/ Down open stacker

Mechanical Layout

Reference Cycle-Time

• Load/ Unload picker: 6 pickers (variable pitch)
• Bin: All bin 1
• Tray: 8 x 16 arrays
• Room temperature: 25°C
• Cycle time = loading + sorting + index (7 seconds).
  Note: Index time: Shuttle buffer in & Out time

Cycle Time Summary	Para	Sum	Loading	Sorting	Index
	40 para	79 secs	36 secs	36 secs	7 secs
	60 para	131 secs	62 secs	62 secs	7 secs
	80 para	151 secs	72 secs	72 secs	7 secs

Reference UPH

Para/ Test Time [sec]	0	60	90	120	151	180	210
40 para	1823	1823	1485	1134	911	770	664
60 para	1649	1649	1649	1649	1367	1155	995
80 para	1907	1907	1907	1907	1823	1540	1327

Enhancement Features

High functionality and improve productivity

• Supports different types of ICs (DRAM, LPDDR and NAND) to run in automation test
• Maximum support of 80 pieces of ICs (from 40 DUTs to 80 DUTs) in parallel tests with multiple rubber sockets
• Supports temperatures ranging from ambient temperature to high temperature (up to 85˚C)
• Supports Empty Socket Checks to prevent damages (such as crushed IC in socket due to unforeseen circumstances)
• Minimizes potential and unexpected problems, increasing productivity
• Supports any customer-selected tester

Specifications

Item		Description
Device		LPDDR4, DDR4, NAND Min. Ball Pitch ≤ 0.5mm / JEDEC tray
UPH		Refer to "Reference Cycle-Time"
Jam Rate		1/20000
Accuracy (Pick & Place)		㎛; ≤100㎛
Load/ Unload Picker		40 Para: 4 pickers; 60 Para: 6 pickers, 80 Para: 8 pickers
Number of Parallels		40 Para/ 60 Para/ 80 Para
Stack Tray		30 trays/ Auto-Bin (4 auto trays) 1 tray/ Manual Bin (2 manual trays)
Temperature Accuracy		Room temperature ~ +85°C +85°C ± 2°C, Rising time 20 minutes
Sorting Bin		Auto 4 bins + Manual 2 bins
Socket		4x10/ 6x10/ 8x10 (Rubber socket)
Ionizer		Stacker (Auto, Manual), Shuttle; 1000V -> 100V : 10 seconds
Dimensions/ Weight		1900 (W) x 1700 (D) x 1800 (H) mm / approx. 1500 kg
Power		AC 220V ±10% / 3 Phase x 2 (AC power requirements)
Safety		Door Open, System Stop & Motor Free Door Close, Hit START button to restart
Interface		PC Base: TCP/IP
Interface Protocol		TCP/IP

Optional		Description
Software		Check Socket Empty (Offers free upgrade if needed) Auto Socket Off (Offers free upgrade if needed)
C.O.K		4 Units: - Pusher (contractor) Unit - Shuttle Buffer - Pitch Plate - Buffer

Software Screenshot