Introducing the Powerful & Reliable TCIII-4266LPIC

Configurable from 4-site to 128-site in parallel testing

TurboCATS is pioneering a high performing TCIII-4266LPIC test system. The TCIII-4266LPIC test system comes with two additional new major features: AC switching noise simulation on the LPDDR4/ 4x, and rubber socket option that can lead better test yield while requiring less maintenance. The system brings a unique combination of performance and affordability to the memory semi-conductor industry. The test system can handle up to 128 devices, which offers high-production throughput. We also offer a handler interface option in sorting and binning for the system.

Productivity with customization

  • LPDDR4 - 1600Mbps, 2133Mbps, 2400Mbps, 2667Mbps, 3200Mbps, 3733Mbps, 4266Mbps
  • LPDDR3 - 1066Mbps, 1333Mbps, 1600Mbps, 1866Mbps, 2133Mbps
  • DDR4 - 1600Mbps, 1866Mbps, 2133Mbps, 2400Mpbs, 2667Mbps, 2866Mbps, 2933Mbps, 3200Mbps
  • DDR3 - 1066Mbps, 1333Mbps, 1600Mbps, 1866Mbps, 2133Mbps
  • Clock frequency from 533MHz to 2133MHz
  • Optional heat chamber and rubber-sockets handler docking
  • Proper chassis design to meet various selective handlers requirement

What is Rubber Sockets?

Breakthrough high speed testing technology

  • Rubber Sockets support high speeds up to 16GHz
  • Support Clamshell Sockets
  • Support a wide-range temperature
  • A better yield with non-damaging solder balls on DUTs
  • Less maintenance is required
  • More flexibility for finer pitch capability

eMCP Function

eMMC + LPDDR4/ LPDDR3

  • LPDDR4/3 and eMMC are tested Interactively or individually by different adaptor boards
  • Interactive Test by eMCP(LPDDR4/ 4x + eMMC) DUT board
    1. - DC Patterns test: LPDDR4/ 4x ONLY
      - Device Functional test: LPDDR4/ 4x and eMMC
  • Individual Test by eMMC DUT board
    1. - DC Patterns test: eMMC ONLY
      - Device Functional test: eMMC ONLY
  • Support eMMC formatting flow for eMMC card settings
  • Easy to reconfigure different types of packages and devices

Multi-Site Networking

Solutions for your connected testing

The TCIII-4266LPIC (LPDDR4/ LPDDR3) IC test system can be networked so the user can test up to 128 devices using one PC to control the entire operation. This gives the customer greater flexibility in terms of increasing testing capacity on an as-needed basis.

GCOM-6040 IC Handler Interface

Support LPDDR4/ LPDDR3

GCOM-6040 Features

  • A tray Pick-and-Place type IC handler
  • Support different types of ICs, run in automation test
  • Drag and drop operation
  • Loading & Unloading robot
  • Shuttle buffer
  • Tray stacker
  • Test contractor
  • Extremely intuitive software GUI
  • Support any customer-selected tester
  • Click here for more information

Features

Powered for Productivity

Test Capabilities

  • LPDDR4 - 1600Mbps, 2133Mbps, 2400Mbps, 2667Mbps, 3200Mbps, 3733Mbps, 4266Mbps
  • LPDDR3 - 1066Mbps, 1333Mbps, 1600Mbps, 1866Mbps, 2133Mbps
  • DDR4 - 1600Mbps, 1866Mbps, 2133Mbps, 2400Mpbs, 2667Mbps, 2866Mbps, 2933Mbps, 3200Mbps
  • DDR3 - 1066Mbps, 1333Mbps, 1600Mbps, 1866Mbps, 2133Mbps
  • Clock frequency from 533MHz to 2133MHz

Flexible Configuration

  • Configurable from 4-site to 128-site for parallel testing
  • Proper chassis design to meet various selective handlers requirement
  • Optional environmental tests high temperatures ranging from 25˚C to 125˚C
  • Support speed tests from 1600Mbps to 4266Mbps for LPDDR4/ 4x
  • Optional heat chamber and rubber-socket handler docking

GUI Failure Analysis Tool

  • Failed IC's and DQ's
  • Error Logging
  • Bit Mapping
  • Shmoo Plot

DC & AC Parametric Tests

  • Support VSIM
  • Continuity, Leakage, Idd's measurement
  • Over 35 industry standard test patterns
  • User-defined AC patterns programming
  • Auto Timing Calibration
  • Application Tests
    1. - Calibration and Self Training
      - AC Switching Noise Simulation
      - Boot Vector (e.g., Boot Vector Patterns)

      Boot Vector Patterns

      TurboCATS has developed a circuit in the TCIII-4266LPIC system to emulate the platforms boot up sequence. This pattern can detect errors from memory devices during boot up sequence.

      We have also developed two other application patterns as well in the TCIII-4266LPIC system that can detect errors from the memory devices:

      A) Calibration test: Detects self training problem
      B) High No