The TCIII-21UPS Die Probing Station
Get the Technology You Need to Grow
Testing Capabilities
Built to Fit Your Memory Testing Needs
- DDR3/ DDR4
- LPDDR2/ LPDDR3/ LPDDR4
- NAND Flash
- Supports speeds up to 400Mbps
How It Works
- Supports high productivity and enhances efficiency of the handler system
- 2 work zones
- Supports semi-automated Die Handler with TurboCATS series
- Operator loads die on buffer plate and starts the test
- Prevents Probe Card damage during load and unload operations
- Prevents contact fail due to improper alignment
Power Up with the Semi-Automated Die Handler
Stable Handling for Small Packages
Features & Specifications
DDR3/ DDR4
DDR3 | DDR4 | |
Test Frequency | Speed up to 200MHz | |
Switching Data Rate | Speed up to 400Mbps | |
I/O Interface | SSTL-15, Class I & Class II SSTL-135, Class I & Class II |
POD12-1.2V Pseudo Open Drain I/O |
Clock Lines | 1 pair | |
Address Depth | 16 Rows, 15 Columns, 3 BAs 16X/ 15Y/ 3Z per site |
17 Rows, 15 Columns, 4 BAs 17X/ 15Y/ 4Z per site |
Data Width & Depth | 8 I/O, Supports 8/ 16/ 32 bit IC devices | |
Control | 2 CS's, 2 CLKE, 1 RAS, 1CAS, 1WE | |
Termination | On chip, dynamic | |
Variable Timing Edges | tSU/ tHD, tWD, tDQSS, tAC, etc | |
Programmable Timing | tRCD, tRP, tCL, tAL, tCWL, tWR, tRL, tWL, tRFC, etc. 1 pair of clock per IC socket |
LPDDR2/ LPDDR3
LPDDR2 | LPDDR3 | |
Test Frequency | Speed up to 200MHz | |
Switching Data Rate | Speed up to 400Mbps | |
I/O Interface | 1.2V HSTL Class | 1.2V HSUL |
Clock Lines | 1 pair | |
Address Depth | 14 Rows, 10 Columns, 3 BAs | 16 Rows, 15 Columns, 3 BAs |
Data Width & Depth | 8 I/O, Supports 8/ 16/ 32 bit IC devices | |
Control | 2 CS's, 2 CKE, 10 CA | |
Termination | On-chip, dynamic | |
Variable Timing Edges | tSU/ tHD, tWD, tDQSS, tAC | |
Programmable Timing | tRCD, tRP, tWR, tRL, tWL, tRC, tRTP, tRFC, etc. 1 pair of clock per IC socket |
NAND Flash
Test Frequency | Supports 100 and 200MHz | |||
Switching Data Rate | Supports 200 and 400Mbps | |||
I/O Interface | ONFI 1.0, ONFI 2.0, ONFI 3.0, Toggle NANDFlash | |||
Control | Async: CE#, R/B#; RE#, ALE, WP#, CLE, WE# | |||
NV-DDR: CE#, R/B#; W/R#, ALE, WP#, CLE, CLK, DQS | ||||
NV-DDR2: CE#, R/B#, CLE, ALE, RE, WR, WP#, DQS | ||||
Variable Timing Edge | tDS, tDH | |||
Programming Timing | Async: tCLS, tCLH, tALS, tALH, tWP, tWH, tDS, tDH, tWC, tADL, tCH, tWW, tCS, tRP, tRC, tREA, tRR, tOH, tWHR, tAR, tWB, tREH, tRHW, tWHR2, tBERS, tR, tPROG | |||
NV-DDR: tADL, tCAD, tCALS, tDS, tCCS, tDQSCK, tDQSS, tRHW, tWB, tWHR , tWW, tWPRE, tWPST, tBERS, tPROG, tR | ||||
NV-DDR2: tADL, tCALS, tCALH, tCS, tCH, tAR, tRR, tWB, tWHR, tWC, tWP, tWW, tWHR2, tWPRE, tCAS, tCAH, tCDQSS, tCDQSH, tWPST, tWPSTH, tRPRE, tDQSRE, tRPST, tRPSTH, tBERS, tR, tPROG |
DC Tests | DC Open, Shorts/ Leakage, Idds Measurement | ||||
System & Software Features | DC & AC Parametric Test:
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GUI Failure Analysis Tool:
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Flexible Configuration : Configurable from 6 to 512 sites for parallel test on production floor.
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Semi-Automated Die Handler:
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Control PC | Windows 7 operating system (64 bit) or better, Networking interface | ||||
AC Power Source | 110-240VAC, 50/60Hz | ||||
External PC Requirement | Executes software to control station operation. Windows 7 operating system (64 bit) or better, i7-core or above, 8G RAM or above, CD ROM, LAN port x2, USB port, monitor with 1920 x 1080 resolution or higher, keyboard, mouse, display card or on-board display |
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Temperature Limitation | 16°C to 32°C (60.8°F to 89.6°F) | ||||
Humidity Limitation | 20% to 80% |
Software Screenshots
Main Operating Window
Test Device Configuration
Edit Device Page
Security Privilege
TURBOCATS, LTD. RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.