Built To Fit Your Memory Testing Needs

At Speed Test Up to 3733Mbps

To assist manufacturers in their efforts to control costs, TurboCATS proudly introduces the new TCIII-3733LPIC multi-site test system. The TCIII-3733LPIC system comes with two additional new major features: AC switching noise simulation on the LPDDR4/ 4x, and rubber socket option that can lead better test yield while requiring less maintenance. The system can handle up to 128 devices, which offers high-production throughput. We also offer a handler interface option in sorting and binning for the system.

Customizable Features

• LPDDR4 - 1600Mbps, 2133Mbps, 2400Mbps, 2667Mbps, 3200Mbps, 3733Mbps
• LPDDR3 - 1066Mbps, 1333Mbps, 1600Mbps, 1866Mbps, 2133Mbps
• DDR4 - 1600Mbps, 1866Mbps, 2133Mbps, 2400Mpbs, 2667Mbps, 2866Mbps, 2933Mbps, 3200Mbps
• DDR3 - 1066Mbps, 1333Mbps, 1600Mbps, 1866Mbps, 2133Mbps
• Clock frequency from 533MHz to 1866MHz
• Configurable from 4-site to 128-site for parallel testing
• Optional heat chamber and rubber-sockets handler docking
• Proper chassis design to meet various selective handlers requirement

What is Rubber Sockets?

Breakthrough High Speed Testing Technology

• Rubber Sockets support high speeds up to 16GHz
• Support Clamshell Sockets
• Support a wide-range temperature
• A better yield with non-damaging solder balls on DUTs
• Less maintenance is required
• More flexibility for finer pitch capability

eMCP Function

eMMC + LPDDR4/ LPDDR3

• LPDDR4/ LPDDR3 and eMMC are tested Interactively or individually by different adaptor boards
• Interactive Test by eMCP(LPDDR4/ 4x + eMMC) DUT board
- DC Patterns test: LPDDR4/ 4x ONLY
- Device Functional test: LPDDR4/ 4x and eMMC
• Individual Test by eMMC DUT board
- DC Patterns test: eMMC ONLY
- Device Functional test: eMMC ONLY
• Supports eMMC formatting flow for eMMC card settings
• Easy to reconfigure different types of packages and devices

Multi-Site Networking

Solutions for your Connected Testing

The TCIII-3733LPIC (LPDDR4/ LPDDR3) IC test system can be networked so the user can test up to 128 devices using one PC to control the entire operation. This gives the customer greater flexibility in terms of increasing testing capacity on an as-needed basis.

GCOM-6040 IC Handler Interface (optional)

Supports LPDDR4/ LPDDR3

Features

Testing Capabilities

• LPDDR4 - 1600Mbps, 2133Mbps, 2400Mbps, 2667Mbps, 3200Mbps, 3733Mbps
• LPDDR3 - 1066Mbps, 1333Mbps, 1600Mbps, 1866Mbps, 2133Mbps
• DDR4 - 1600Mbps, 1866Mbps, 2133Mbps, 2400Mpbs, 2667Mbps, 2866Mbps, 2933Mbps, 3200Mbps
• DDR3 - 1066Mbps, 1333Mbps, 1600Mbps, 1866Mbps, 2133Mbps
• Clock frequency from 533MHz to 1866MHz

Flexible Configuration

• Configurable from 4-site to 128-site for parallel testing
• Proper chassis design to meet various selective handlers requirement
• Optional environmental tests high temperatures ranging from 25˚C to 125˚C
• Supports speed tests from 1600Mbps to 3733Mbps for LPDDR4/ 4x
• Optional heat chamber and rubber-socket handler docking

GUI Failure Analysis Tool

• Failed IC's and DQ's
• Error Logging
• Bit Mapping
• Shmoo Plot
• Eye Diagram

DC & AC Parametric Tests

• Supports VSIM
• Continuity, Leakage, Idd's measurement
• Over 35 industry standard test patterns
• User-defined AC patterns programming
• Auto Timing Calibration
• Application Tests
- Calibration and Self Training
- AC Switching Noise Simulation
- Boot Vector (e.g., Boot Vector Patterns)

Boot Vector Patterns
TurboCATS has developed a new circuit in the TCIII-3733LPIC system to emulate the platforms boot up sequence. This pattern can detect errors from memory devices during boot up sequence.

We have also developed two other application patterns as well in the TCIII-3733LPIC test system that can detect errors from the memory devices:

A) Calibration test: Detects self training problem
B) High Noise Simulation: Detects any switching noise problem

Powerful Integration Tool

eMCP Function

• LPDDR4/ 4x, LPDDR3 and eMMC
• LPDDR4: 3733Mbps
LPDDR3: 2133Mbps
• eMMC Application Flow

GUI Failure Analysis

Graphical Identification of Failed DQs' Locations

Represents the failed DQ pins locations, graphically. The software uses a graphical picture to show the test failures at the hardware level: If the IC fails during the test, there would be indications (displayed in RED) marking the failed pin(s) and signal(s).

Address/ Data Logging

Error logging can analyze failures by using address and data information.

Bit Failure Mapping

A tool that helps the user to find and display the failed DQ bits in the RAM. The corresponding row and column addresses the failed DQ bits, which will be spotted and displayed for the user.

Shmoo Plot

A two-dimensional diagram that shows the status of the DQ bits of Memory ICs varying over a range of the user's selected parameters (timing and input voltage level).

Pattern Programming Function (optional)

The customer can use a C++ programming language to create a customized AC Command pattern. The programming function also serves as a powerful compiler/debug tool for Pattern programming and allows the user to monitor the timing waveform of the algorithm along with the timing bus transactions. This is all accomplished under the Software.

Specifications: LPDDR4 & LPDDR4x

Test Frequency	LPDDR4, 800Mhz to 1600/ 1866 MHz
Switching Data Rate	LPDDR4, 1600Mbps to 3200/ 3733 Mbps
I/O Interface	LPDDR4, Support LVSTL
Clock Lines	1 pair per site
Address Depth	LPDDR4/ 4x:	17 Rows, 10 Columns, 3 BAs (17X/ 10Y/ 3Z) per site
Data Width	16 DQs/ 32 DQs
Termination	On-chip, dynamic
Variable Timing Edges	tRCD, tCL, tRL, tWL, tAL, tRP, tRFC, tWR, tCWL, etc
Programmable Timing	tRCD, tRP, tCCD, tRL, tFAW, tWTR, tRAS, tRTP, tRFC, etc

Specifications: LPDDR3

Test Frequency	LPDDR3, 667Mhz to 1066Mhz
Switching Data Rate	LPDDR3, 1333Mbps to 2133Mbps
I/O Interface	LPDDR3, 1.2V HSUL
Clock Lines	1 pair per site
Address Depth	LPDDR3:	15 Rows, 12 Columns, 3 BAs (15X/ 12Y/ 3Z) per site
Data Width	16 DQs/ 32 DQs
Termination	On-chip, dynamic
Variable Timing Edges	tRCD, tCL, tRL, tWL, tAL, tRP, tRFC, tWR, tCWL, etc
Programmable Timing	tRCD, tRP, tCCD, tRL, tFAW, tWTR, tRAS, tRTP, tRFC, etc

Specifications: eMMC

Speed Mode	Supports High Speed, HS200 and HS400
Operating Voltage	Vcc Range: 2.35V to 3.3V
	VccQ Range: 1.6V to 1.95V
Test Function	Interactive Test by eMCP (LPDDR4/4x + eMMC) DUT Board - DC Patterns Test: LPDDR4/4x only - Device Functional Test: LPDDR4/4x and eMMC
	Individual Test by eMMC DUT Board - DC Patterns Test: eMMC only - Device Function Test: eMMC only
Read ID Function	CID (Device Identification Register) Read
	CSD (Device Specific Data) Read
	Extended CSD Register Read
User Function	Device Erase, Write and Read function: - User can define the percentage of Erase/ Write/ Read area in User Test-Pattern programming.

Specifications: DDR3 & DDR4

Test Frequency	DDR3 - 667Mhz to 933Mhz
	DDR4 - 800Mhz to 1333/ 1600Mhz
Switching Data Rate	DDR3 - 1333Mbps to 1866Mbps
	DDR4 - 1600Mbps to 2667/ 3200Mbps
I/O Interface	DDR3 - SSTL-15, Class I & Class II
	DDR3 - SSTL-135, Class I & Class II
	DDR4 - POD12-1.2V Pseudo Open Drain I/O
Clock Lines	1 pair per site
Address Depth	DDR3 - 16 Rows, 15 Columns, 3 BAs (16X/15Y/3Z) per site
	DDR4 - 18 Rows, 15 Columns, 4 BAs (18X/15Y/4Z) per site
Data Width	4 DQs / 8 DQs / 16 DQs / 32 DQs
Termination	On-chip, dynamic
Variable Timing Edges	tSU/tHD, tAC (tDS/DH), tDQSS, tWD, etc
Programmable Timing	tSU/tHD, tWD, tDQSS, tAC, tSREF, tREF, etc

Minimum Hardware Requirements

External PC requirements	Execute TCIII-3733LPIC software to control station operation Windows 10, 64-bit, build ver. 2004 operating system or above.
	PC Minimum Requirements: - CPU: Quad-core Intel/ AMD CPU with clock freq. at least 3.60 GHz (Intel Core i5-6500 or AMD equivalent) - RAM: 8 GB, HDD Space: 60GB - 1920 x 1080 Resolution capable display
	Recommended Requirements - CPU: Hexa-core Intel/ AMD CPU with clock freq. at least 4.00 GHz (Intel Core i5-8400 or AMD equivalent) - RAM: 16GB, HDD Space:100GB - 1920 x 1080 Resolution capable display or above
	Remark: The configuration of PC will affect the testing efficient.
AC Power Source	110-240V (AC), 50/60Hz
Recommended Temperature	16°C to 32°C (60.8°F to 89.6°F)
Humidity Limitation	20% to 80%

TCIII-3733LPIC & Heat Chamber (optional)

The heat chamber creates a high temperature testing environment to simulate the accelerated life testing and analyze the behaviors of the module.

Heat Chamber Specifications

Power Supply	220V, 50Hz (90 - 110% of rated voltage)
Power Consumption	Power-up: 15A, 220V
	Normal operation: 10A, 220V
Display Method	Red 7 Segment LED Display
Storage Temperature	-20°C - 60°C
Ambient Humidity	35% - 85% RH
Temperature Range	25°C - 85°C
Recommended Setting Temperature	80°C
Air Input	Min. 0.5 MPa - Max. 1.0 MPa
	Min. 75 psi - 145 psi
Diameter of Gas Tube	6 mm

Software Screenshots